An Adaptive Entanglement Distillation Scheme Using Quantum Low Density Parity Check Codes

Quantum low density parity check (QLDPC) codes are useful primitives for quantum information processing because they can be encoded and decoded efficiently. Besides, the error correcting capability of a few QLDPC codes exceeds the quantum Gilbert-Varshamov bound. Here, we report a numerical performance analysis of an adaptive entanglement distillation scheme using QLDPC codes. In particular, we find that the expected yield of our adaptive distillation scheme to combat depolarization errors exceed that of Leung and Shor whenever the error probability is less than about 0.07 or greater than about 0.28. This finding illustrates the effectiveness of using QLDPC codes in entanglement distillation.Comment: 12 pages, 6 figure

Minority Game With Peer Pressure

To study the interplay between global market choice and local peer pressure, we construct a minority-game-like econophysical model. In this so-called networked minority game model, every selfish player uses both the historical minority choice of the population and the historical choice of one's neighbors in an unbiased manner to make decision. Results of numerical simulation show that the level of cooperation in the networked minority game differs remarkably from the original minority game as well as the prediction of the crowd-anticrowd theory. We argue that the deviation from the crowd-anticrowd theory is due to the negligence of the effect of a four point correlation function in the effective Hamiltonian of the system.Comment: 10 pages, 3 figures in revtex 4.

Analysis of opposed jet hydrogen-air counter flow diffusion flame

A computational simulation of the opposed-jet diffusion flame is performed to study its structure and extinction limits. The present analysis concentrates on the nitrogen-diluted hydrogen-air diffusion flame, which provides the basic information for many vehicle designs such as the aerospace plane for which hydrogen is a candidate as the fuel. The computer program uses the time-marching technique to solve the energy and species equations coupled with the momentum equation solved by the collocation method. The procedure is implemented in two stages. In the first stage, a one-step forward overal chemical reaction is chosen with the gas phase chemical reaction rate determined by comparison with experimental data. In the second stage, a complete chemical reaction mechanism is introduced with detailed thermodynamic and transport property calculations. Comparison between experimental extinction data and theoretical predictions is discussed. The effects of thermal diffusion as well as Lewis number and Prandtl number variations on the diffusion flame are also presented

Biodegradable Polylactic Acid (PLA) Microstructures for Scaffold Applications

In this research, we present a simple and cost effective soft lithographic process to fabricate PLA scaffolds for tissue engineering. In which, the negative photoresist JSR THB-120N was spun on a glass subtract followed by conventional UV lithographic processes to fabricate the master to cast the PDMS elastomeric mold. A thin poly(vinyl alcohol) (PVA) layer was used as a mode release such that the PLA scaffold can be easily peeled off. The PLA precursor solution was then cast onto the PDMS mold to form the PLA microstructures. After evaporating the solvent, the PLA microstructures can be easily peeled off from the PDMS mold. Experimental results show that the desired microvessels scaffold can be successfully transferred to the biodegradable polymer PLA.Comment: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing

Probabilistic evaluation of SSME structural components

The application is described of Composite Load Spectra (CLS) and Numerical Evaluation of Stochastic Structures Under Stress (NESSUS) family of computer codes to the probabilistic structural analysis of four Space Shuttle Main Engine (SSME) space propulsion system components. These components are subjected to environments that are influenced by many random variables. The applications consider a wide breadth of uncertainties encountered in practice, while simultaneously covering a wide area of structural mechanics. This has been done consistent with the primary design requirement for each component. The probabilistic application studies are discussed using finite element models that have been typically used in the past in deterministic analysis studies

Stress-Induced Delamination Of Through Silicon Via Structures

Continuous scaling of on-chip wiring structures has brought significant challenges for materials and processes beyond the 32 nm technology node in microelectronics. Recently three-dimensional (3-D) integration with through-silicon-vias (TSVs) has emerged as an effective solution to meet the future interconnect requirement. Thermo-mechanical reliability is a key concern for the development of TSV structures used in die stacking as 3-D interconnects. This paper examines the effect of thermal stresses on interfacial reliability of TSV structures. First, the three-dimensional distribution of the thermal stress near the TSV and the wafer surface is analyzed. Using a linear superposition method, a semi-analytic solution is developed for a simplified structure consisting of a single TSV embedded in a silicon (Si) wafer. The solution is verified for relatively thick wafers by comparing to numerical results obtained by finite element analysis (FEA). Results from the stress analysis suggest interfacial delamination as a potential failure mechanism for the TSV structure. Analytical solutions for various TSV designs are then obtained for the steady-state energy release rate as an upper bound for the interfacial fracture driving force, while the effect of crack length is evaluated numerically by FEA. Based on these results, the effects of TSV designs and via material properties on the interfacial reliability are elucidated. Finally, potential failure mechanisms for TSV pop-up due to interfacial fracture are discussed.Aerospace Engineerin

Forecasting the manpower demand for quantity surveyors in Hong Kong

Recently, there has been a massive infrastructure development and an increasing demand for public and private housing, resulting in a shortage of qualified quantity surveyors. This study aims to forecast the demand for qualified quantity surveyors in Hong Kong from 2013 to 2015. Literature review indicates that the demand for quantity surveyors is a function of the gross values of building, civil engineering and maintenance works. The proposed forecasting method consists of two steps. The first step is to estimate the gross values of building, civil engineering and maintenance works by time series methods and the second step is to forecast the manpower demand for quantity surveyors by causal methods. The data for quantity surveyors and construction outputs are based on the ‘manpower survey reports of the building and civil engineering industry’ and the ‘gross value of construction works performed by main contractors’ respectively. The forecasted manpower demand for quantity surveyors in 2013, 2014 and 2015 are 2,480, 2,632 and 2,804 respectively. Due to the low passing rate of the assessment of professional competence (APC) and the increasing number of retired qualified members, there will be a serious shortage of qualified quantity surveyors in the coming three years